Xpack4 components: Combine your own customized system
The following provides an overview of all the components you need to build an Xpack4 system. You can choose between differently equipped variants in every class of components, so you can match your requirement profile as accurately as possible.
In the automotive, aerospace, railway and industrial automation sectors, M-Modules are used to process digital and analog signals. They are attached to the carrier board, where they communicate via a dedicated bus. One of the main advantages of M-Modules is that they can be used in a fully modular way. This enables you to equip your Xpack4 system exactly as needed so that it only offers the functions you actually require.
The different M-Modules available offer a diverse range of options. For example, you can choose between M-Modules for cases of applications such as the processing of analog/digital I/O signals and complex application scenarios like CAN FD or intelligent wheel speed sensors. We also provide FPGA development services to expand the existing product portfolio according to your individual needs.
The CPU board determines the performance of your Xpack4 system. As with M-Modules, you can choose between hardware of varying levels of performance to suit the application at hand. Our CPU boards are compatible with all CarMaker/RealtimeMaker routines. Should your system requirements change at any time, you can use plug & play to exchange the CPU board for a different, more powerful model. This will not affect the rest of the hardware components in the Xpack4 system, which can continue to be used as before.
As M-Modules are bus-independent, they can be used in many different hardware systems, such as CompactPCI (Xpack4), PXI (NI) or VMEbus systems. To use an M-Module in one of these systems, you will need a carrier board to which up to four M-Modules can be attached.
We offer suitable carrier boards for all types of housing and application. Special carrier boards are required for special functions like rear I/O.
Once you have compiled the right hardware for your specific application, you can select the suitable housing for it. Simply choose the format that best fits your needs. Different sizes are available for different applications – whether stationary, mobile in a vehicle, for a rack installation or as table housing in a lab – with virtually any number of M-Modules.
Our housings are fitted with ventilation systems quiet enough to allow the systems to be used in offices without drawing unwanted attention to themselves.
If you wish to connect your simulation to the high-speed FlexRay bus in order to communicate with actual control units that are equipped accordingly, you will need special FlexRay hardware.
You can use EtherCAT technology to connect test bench components that need to exchange data in very dynamic processes where time is critical. These components may comprise any type of actuator or sensor.
Overview of our Xpack4 components
For detailed information, please click here and download the PDF file
M27: 16 binary outputs, low side switch
M28: 16 binary outputs, high side switch
M31: 16 binary inputs, load on ground
M32: 16 binary inputs, load on supply voltage
M35N00: 16 analog inputs, 14 bits, single-ended
M35N02: 8 analog inputs, 14 bits, differential
M36N00: 16 analog inputs, 16 bits, single-ended
M-Modules for special applications
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